Call for Chapters: Advanced Research on Microwave Components, Computing, Electronics, and Electrical Engineering

Editors

EUGENE OGBODO, University of Hertfordshire, United Kingdom

Call for Chapters

Proposals Submission Deadline: July 16, 2026
 Full Chapters Due: September 17, 2026
 Submission Date: September 17, 2026

Introduction

The rapid advancement of microwave engineering, computing technologies, electronics, and electrical engineering is transforming industries, economies, and societies worldwide. Innovations in high-frequency communication systems, intelligent computing, semiconductor technologies, power systems, renewable energy integration, embedded systems, and advanced electronic devices are driving the development of next-generation infrastructures and applications. These technological breakthroughs are enabling unprecedented levels of connectivity, automation, efficiency, and sustainability across various sectors, including telecommunications, healthcare, manufacturing, transportation, aerospace, and smart cities. The book Advanced Research on Microwave Components, Computing, Electronics, and Electrical Engineering aims to provide a comprehensive platform for researchers, engineers, academics, and industry professionals to present the latest theoretical developments, practical applications, experimental investigations, and emerging trends in these interconnected disciplines. The book seeks to bridge the gap between fundamental research and industrial implementation while highlighting innovative solutions to contemporary engineering challenges. Contributors are invited to submit original chapters that address recent advances, emerging technologies, novel methodologies, case studies, and future directions in microwave engineering, computing, electronics, and electrical engineering.

Objective

The primary objective of this book is to showcase cutting-edge research and technological innovations in microwave components, computing systems, electronics, and electrical engineering. It aims to provide a multidisciplinary platform that promotes knowledge exchange among researchers, practitioners, policymakers, and educators. The book seeks to examine emerging technologies, design methodologies, analytical techniques, and practical applications that contribute to the advancement of communication systems, intelligent computing, electronic devices, power systems, and sustainable engineering solutions. Through high-quality scholarly contributions, the book will serve as a valuable reference for understanding current developments and future opportunities in modern engineering and technology.

Target Audience

This book is intended for researchers, academicians, scientists, engineers, graduate students, industry practitioners, technology developers, and policymakers working in microwave engineering, computing, electronics, telecommunications, and electrical engineering. It will be particularly valuable to professionals seeking insights into emerging technologies, innovative design approaches, practical implementations, and future research directions within modern engineering disciplines.

Recommended Topics

Microwave Engineering and Components - Microwave filters and multiplexers - Antenna design and optimization - Smart antennas and phased array systems - Microwave resonators and waveguides - RF and microwave integrated circuits - Power amplifiers and low-noise amplifiers - Microwave oscillators and frequency synthesizers - Radar systems and microwave sensing technologies - Millimeter-wave and terahertz technologies - Microwave measurements and instrumentation - Metamaterials and electromagnetic structures - Satellite communication systems - Microwave components for 5G and 6G networks - Programmable microwave components Computing and Information Technologies - Artificial intelligence and machine learning - High-performance computing - Cloud and edge computing - Quantum computing - Internet of Things (IoT) - Cybersecurity and information assurance - Big data analytics - Distributed and parallel computing - Computer vision and image processing - Human-computer interaction - Blockchain technologies - Intelligent decision-support systems Electronics and Embedded Systems - Semiconductor devices and fabrication technologies - VLSI and ASIC design - Analog and digital circuit design - Embedded systems and microcontrollers - Sensor technologies and applications - MEMS and NEMS devices - Wearable and flexible electronics - Biomedical electronics - Nanoelectronics and nanotechnology - Electronic packaging and reliability - Consumer electronics innovations - FPGA-based system design Electrical Engineering and Power Systems - Smart grids and intelligent energy systems - Renewable energy technologies - Power electronics and motor drives - Electric vehicles and charging infrastructure - Energy storage systems - Power system protection and control - High-voltage engineering - Electrical machines and drives - Sustainable energy management - Industrial automation and control systems - Robotics and autonomous systems - Grid modernization and resilience Emerging and Interdisciplinary Areas - AI applications in microwave and electronic systems - Digital twins for engineering systems - Smart cities and intelligent infrastructure - Industry 4.0 and Industry 5.0 technologies - Green electronics and sustainable engineering - Wireless power transfer - Quantum communication systems - Advanced materials for electronic and microwave applications - Intelligent manufacturing systems - Future communication technologies

Submission Procedure

Researchers and practitioners are invited to submit on or before July 16, 2026, a chapter proposal of 1,000 to 2,000 words clearly explaining the mission and concerns of his or her proposed chapter. Authors will be notified by July 30, 2026 about the status of their proposals and sent chapter guidelines.Full chapters of a minimum of 10,000 words (word count includes references and related readings) are expected to be submitted by September 17, 2026, and all interested authors must consult the guidelines for manuscript submissions at https://www.igi-global.com/publish/contributor-resources/before-you-write/ prior to submission. All submitted chapters will be reviewed on a double-anonymized review basis. Contributors may also be requested to serve as reviewers for this project.

Note: There are no submission or acceptance fees for manuscripts submitted to this book publication, Advanced Research on Microwave Components, Computing, Electronics, and Electrical Engineering. All manuscripts are accepted based on a double-anonymized peer review editorial process.

All proposals should be submitted through the eEditorial Discovery® online submission manager.

Publisher

This book is scheduled to be published by IGI Global Scientific Publishing, an international academic publisher of the "Information Science Reference", "Medical Information Science Reference", "Business Science Reference", and "Engineering Science Reference" imprints. IGI Global Scientific Publishing specializes in publishing reference books, scholarly journals, and electronic databases featuring academic research on a variety of innovative topic areas including, but not limited to, education, social science, medicine and healthcare, business and management, information science and technology, engineering, public administration, library and information science, media and communication studies, and environmental science. For additional information regarding the publisher, please visit https://www.igi-global.com. This publication is anticipated to be released in 2027.

Indexing Information for Prospective Authors

IGI Global Scientific Publishing meets the criteria for inclusion in major indexing services such as Scopus; however, it is important to note that all indexing decisions are made independently by these services. IGI Global Scientific Publishing books are selectively indexed by the indexing organization after publication. Indexing cannot be guaranteed for any book prior to publication, and the indexing organization has complete control over the final selection and timeline.

Important Dates

July 16, 2026: Proposal Submission Deadline
July 30, 2026: Notification of Acceptance
September 17, 2026: Full Chapter Submission
October 22, 2026: Review Results Returned
November 19, 2026: Final Acceptance Notification
November 26, 2026: Final Chapter Submission

Inquiries

EUGENE OGBODO University of Hertfordshire eugene.ogbodo@gmail.com
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